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Tech Brief: Verification of Thermal Simulations of GaAs FETs Using Liquid Crystal Measurements

Posted on Monday, September 30, 2019
Tech Brief: Verification of Thermal Simulations of GaAs FETs Using Liquid Crystal Measurements

In this tech brief, we consider the junction temperatures of a number of different GaAs FET devices. Liquid crystal measurement techniques are used to determine the required drain current such that the FET junction reached a preset clearing temperature, and these results are then used to drive simulations of the devices predicting the maximum junction temperature. Such experimental validation gives us heightened confidence we can use simulation tools to predict the maximum junction temperature and therefore gain a clear understanding of the reliability of GaAs MMICs.

To read all the results, please download the Tech Brief today! 

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Chelmsford, MA 01824
Phone: 978-467-4290
Fax: 978-467-4294

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Privacy Policy

©2006-2020 Custom MMIC
All rights reserved.

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