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Application Note Helps Achieve Optimal Solder Reflow and Device Attachment

Posted on Tuesday, June 14, 2016
Application Note Helps Achieve Optimal Solder Reflow and Device Attachment

Custom MMIC gladly offers a handy walkthrough of preparing SMT MMIC Solder Reflow profiles in our new note, “Application Note 102: Solder Reflow Profiles for Standard and Lead Free SMT Packages.”

This download provides details and guidelines when developing a solder reflow profile for Custom MMIC SMT devices. Included in Application Note 102 are general soldering guidelines, the technical details associated with reflow solder profiles, and useful notes on varying aspects of the reflow soldering profile parameters. Specifically, this note focuses on the reflow solder profile reference information for screen printing with belt furnace reflow, as is recommended by Custom MMIC.

Download and read the full Application Note, “Solder reflow profiles for standard and lead free SMT packages.”

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Custom MMIC

300 Apollo Drive
Chelmsford, MA 01824
Phone: 978-467-4290
Fax: 978-467-4294

Terms and Conditions

©2006-2017 Custom MMIC
All rights reserved.