CMD162
26-34 GHz (K, Ka, Q Band) Low Noise Amplifier MMIC
End of Life announced May 6, 2021 (PCN 21-0101).
Last Time Buy: Nov 16, 2021
Contact your local sales representative for assistance.
Key Features
- Low current consumption
- Small die size
- Ultra low noise performance
- Positive bias
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| RELL | 21 | Buy Online > | |
| RFMW | 0 | Buy Online > |
Qorvo's CMD162 is a highly efficient GaAs MMIC low noise amplifier ideally suited for EW and communications systems where small size and low power consumption are critical design requirements. The device is optimized for 30 GHz and delivers greater than 22 dB of gain with a corresponding output 1 dB compression point of +7 dBm and noise figure of 1.7 dB. The CMD162 LNA MMIC is a 50 ohm matched design which eliminates the need for external DC blocks and RF port matching. The CMD162 amplifier offers full passivation for increased reliability and moisture protection. This amplifier is the perfect alternative to higher cost hybrid amplifiers.
Typical Applications
- Electronic Warfare (EW)
- Ka Band Radar
- Space
- Satellite Communications (Satcom)
- Phased Arrays
Product Categories
| Frequency Min(GHz) | 26 |
| Frequency Max(GHz) | 34 |
| Gain(dB) | 22 |
| NF(dB) | 1.7 |
| OP1dB(dBm) | 7 |
| OIP3(dBm) | 14 |
| Voltage(V) | 1 to 4 |
| Current(mA) | 25 |
| Package Type | Die |
| RoHS | Yes |
| Lead Free | Yes |
| Halogen Free | Yes |
| ITAR Restricted | No |
| ECCN | 3A001 |
Keysight Model Library
This product is included in our Keysight PathWave System Design (SystemVue) and PathWave RF Synthesis (Genesys) compatible component libraries.
X-Microwave Design System
This product is available as an X-Microwave Block (X-MWblock) for evaluation.
X-MWblocks are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.