Board Thermal Analysis Calculator
Version 1.0
Ground Area Under Device (in^2)
Step 1: Select the package style you will mount to the PCB:
2mm QFN 3mm QFN 4mm QFN 5mm QFN 6mm QFN MSOP-8G QSOP-16G
Thermal Conductivity of PCB (W/in-K)
Step 2: Select the PCB material:
Step 3: Enter the PCB thickness (in mils):
Step 4: Select the PCB via Diameter (in mils):
Thermal Conductivity of Via Fill Material (W/in-K)
Step 5: Select the material filling the vias:
Maximum Number of Allowed Vias
Step 6: Enter the number of vias under or near the package:
NOTE: Make sure the number of vias is less than the maximum number allowed!
Step 7: Enter the operating voltage (in Volts):
Power Dissipation inside package (Watts)
Step 8: Enter the operating current (in mA):
Step 9: Enter the baseplate temperature (°C):
Temperature at the bottom of the package (°C):
Temperature at package bottom (°C)=
PCB bottom (Base Plate) temperature (°C)=
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