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Thermal analysis is all too often overlooked during the circuit design phase, often with disastrous consequences. We at Custom MMIC Design Services have significant experience in the analysis and optimization of structures as a means of reducing their thermal profile. We utilize a commercial finite-element analysis program (ANSYS) to identify and then minimize hot spots within a MMIC, package, or printed circuit board, thus ensuring long-term reliability.
The following are three examples of our analysis capability. If you have a thermal issue with a design and don’t know where to turn, please feel free to contact us. Let us use our experience to help you cool things down.
FETs, HBTs and Boards
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