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In this example, we consider the heat dissipation of a 4mm QFN package on a test board. The package is mounted on a GETEK board that is 31 mils thick and plated with 2 oz. copper. The ground slug area has four 15 mil vias, and the package is dissipating 1 W of power. As we can see, the temperature of the package base plate is approximately 97 ºC, which is nearly 12 degrees higher than the test board baseplate temperature of 85 ºC. Failure to consider the temperature rise to the base of the package can result in a thermal disaster since any device inside the package will be at a elevated level of 97 ºC and not at the supposed level of 85 ºC.
With our capability, we can easily examine the impact of different size and quantity of vias, different board materials, and different plating materials on the temperature rise of the PCB.
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